SCF200 EMI Shielding XYZ Conductive Foam

High Performance EMI Shielding XYZ Conductive Foam
FEATURES & BENEFITS
• High deflection and low compression force
• Good thermal conductivity
• Good EMI suppression

• Meets flamability requirements
• Low Hardness Thermal Conductive Absorber
• Natural tacky on both sides

SCF200 offers an innovative approach to traditional shielding and grounding by providing X, Y, and Z-axis conductivity, enhancing the shielding effectiveness required to meet the increasing microprocessor speeds of today’s computer, telecommunications, and other electronic equipment. This foam is designed for low-cycling applications such as input/output (I/O) shielding and other non-shear standard connectors

FEATURES & BENEFITS

• Excellent z-axia conductivity to provide effective EMI shielding and grounding

• Available with or without conductive PSA

• Halogen free and RoHS in compliance

• Low compression forces and light weight

Typical Applications

• PDA digital camera、game machine、server etc.

• Medical equipment

• Desktop computers

• Printers, tablets and smartphones

AVAILABLE OPTIONS

· Standard sheet size: 500x500mm or customized

· With or without 1-side conductive PSA

· Available in sheet / roll or precut finished parts

Part No. Code:

Check List of Reliability Test Report for SCF200 EMI Shielding XYZ Conductive Foam is available after your request

Below info will be helpful for your right application

How to transfer or dissipate the heat from the heat-generating components to heat sinks?

How To Select the Right Thermal Interface Materials for your new application?

Pls feel free to contact us as Thermal Management Solutions available in IBH Technology.

Certification:

High Thermal Conductivity Heat Conductive Silicon Adhesive Electrical Insulating Pad

Strong Logistics System:

High Thermal Conductivity Heat Conductive Silicon Adhesive Electrical Insulating Pad